HDI PCBs
High-Density Interconnect
Extremely fine pitch PCB’s with laser microvias
Jamtronics produces high density interconnect boards for customers, with blind and buried vias, laser drilled vias and impedance control, we manufacture complex build up boards using a large choice of high quality laminate and prepreg.
Mixed copper thickness, various types of surface finish (hard gold plating, hot air leveling, immersion tin or silver, ENIG, ENEPIG) and selective gold plating are available with RoHS Standard. We enable our customers to take advantage of new and high-density component technologies.
HDI Advantages
The advantages of utilizing any or all of these interconnect options are to aid in the reduction of the board area and to increase component and routing density which increases functionality. HDI features may also provide lower inductance signal paths, better thermal conduction, and lower layer count and weight of the finished product.
