1. We use DFM Software to review and 100% check customers’ Gerber
files to ensure manufacturability.
2.Check plots are sent to customers for approval prior to production.
3. First Article Inspection is carried out in every process to
ensure IPC-A-600 and customer specifications are met.
4. Complete Inspection under the microscope of all panels after
PTH (Plating Through Holes) to confirm there are no void holes or any debris.
5. Complete Inspection under the microscope of all panels after
film development to confirm there are no scratches or any over under-developing.
6. Complete Inspection of all panels under the microscope after
film stripping to confirm there are no film chips remaining on panels.
7. After Etching, inspect under microscope check to confirm no
under-over etching has occurred and measurement of trace width.
13. E-Test Electrical Testing is performed before solder mask to ensure the integrity of circuit (no shorts or open circuits) and final 100% E-test of all boards prior to shipping.
14. Measurement After a complete inspection of all finished boards to make sure that all customers’ specifications are met and all IPC-A-610 Standards such as board dimensions, hole, and slot sizes, board thickness, and board finish are met.
15. Micro-sectioning To ensure that there is no internal failure, we carry our cross-section of the final boards, make cross-section coupons, inspect and measure the internal structure and prepare cross-section report.
16. Upon request, we provide quality records such as First Article Report, Impedance Record, E-Test Report, Cross Section Report, Final Inspection Report, CMI Report, CoC Certificates, RoHS certificate, REACH Conflict Mineral Compliance certificates to the customer.
